Automatic glue tape lamination

Equipment reference : BGI100
  • Used for standard 35mm width reels
  • Suitable for sensor lamination
  • Up to 10 000 units per hour
Automatic glue tape lamination

Laminates hotmelt tape on reels of chips

Automatic equipment for smart card production.

 

Advantages

  • Stand alone equipment for standard 35mm reels of chips
  • Screen touch interface with 30 programs memory
  • Suitable for contact, dual interface and sensor lamination
  • EAsy adjustement of time, pressure and temperature
  • Step by step indexing with pins
  • Quick change of punch tool

  

Characteristics

  • Dimensions: 1500 x 560 x 1700mm
  • Weight: 95 kg