Automatic glue tape lamination

Equipment reference : BGi100
  • Suitable for biometric sensor lamination
  • Used for standard 35mm width reels
  • Up to 10 000 units per hour
  • Optional glue tape punch
Automatic glue tape lamination

Laminates hotmelt tape on reels of chips and biometric sensors

Automatic equipment for smart card and biometric card production.



  • Stand alone equipment for standard 35mm reels of chips and biometric sensors
  • Screen touch interface with 30 programs memory
  • Suitable for contact, dual interface and biometric sensor lamination
  • Easy adjustement of time, pressure and temperature
  • Step by step indexing with pins
  • Quick change of punch tool
  • Optional punch of the glue tape prior to lamination



  • Dimensions: 1480 x 480 x 1650mm
  • Weight: 85 kg