ICM adhesion

Equipment reference : BGI175B
  • Follows CQM 2018: TM-423
  • Also called Back of card spot pressure
  • Test further than the norm
  • Optional driller tool to prepare the card
ICM adhesion
  • ICM adhesion
  • ICM adhesion

ICM adhesion test for smart cards

This equipment follows CQM 2018: TM-423 norm.

It is also known as Back of card spot pressure test.

 

Advantages

  • Easy to use to precut peel strength strips
  • Stand alone equipment with color screen touch interface
  • Graphic return of the test
  • Create and save up to 30 programming test sessions
  • Possibility to modify parameters to test futher than the norm
  • Tests for contact, magstripe, dual, combi and customized cards with embossed characters
  • Works with driller tool: BGI120C

 

Option

  • Tool to perform GSM/SIM plug push

 

Norms

  • CQM 2018: TM-423
  • In conformity with CE directives

 

Characteristics

  • Dimensions: 340 x 320 x 720mm
  • Weight: 18,1 Kg