Glue tape lamination

BG INGENIERIE proposes 2 solutions for glue tape lamination, in order to glue hotmelt tape and ACF conductive hotmelt glue on reels of chips and biometric sensors, whatever the dimensions of chips - sensors, for production capacity of up to 10 000 units per hour.

Both solutions offer the possibility to have tape punch prior to lamination.


Equipment suitable for biometric card production.