Glue tape lamination
BG INGENIERIE proposes 2 solutions for glue tape lamination, in order to glue hotmelt tape on reels of chips, whatever the size of the chips, for production capacity of up to 10 000 units per hour.
Working with any chip dimension, it offers the possibility to add tape punch prior to lamination.
- Manual glue tape lamination: for small production, lab purposes and material testing. This unit can be completed by the manual hotmelt tape punch,
- Automatic glue tape lamination: for every day and bigger productions
