Automated IC - SMD - eSIM programming
Equipment reference : BGI169- Automated IC, SMD & eSIMs programmer
- I/O: tapes & trays
- Laser, OCR and AOI as option
- Up to 4 500 uph and 72 programming sockets
- Quick changeover time for sockets and nozzle
- Multiple form factor: WLCSP, MFF2, QFN, DFN, µSD...
Automated programming system with laser for IC, SMD and eSIMs
Advantages
- Adapted to medium and large production runs
- Automated pick & place of components for trays, up to 72 programming sockets
- Pick and place of 8 components at once (more on demand)
- Accepts various form factor: WLCSP, MFF2, µSD, BGA, QFN, DFN, SOIC, PLCC...
- Quick changeover time for socket and nozzle
Options
- Laser engraving (IR or UV)
- OCR verification
- AOI (automated Optical Inspection)
- We can integrate YOUR programmers
Throughput examples (no laser, no OCR)
- Functionality test: 4 500 uph with 8 sockets
- 10s prog per SMD: 3 900 uph with 16 sockets
- 30s prog per SMD: 3 300 uph with 32 sockets
- 60s prog per SMD: 2 650 uph with 48 sockets
Throughput examples with laser and OCR
- 10s prog per SMD: 2 800 uph with 16 sockets
- 30s prog per SMD: 2 450 uph with 24 sockets
- 60s prog per SMD: 2 220 uph with 40 sockets
Characteristics
- Dimensions: 1800 x 1800 x 1920mm
- Weight: 650 kg
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