Automated IC - SMD - eSIMs programming

Equipment reference : BGI169
  • Automated IC, SMD & eSIMs programmer
  • I/O: tapes & trays
  • Laser, OCR and AOI as option
  • Up to 3 200 uph and 72 programming sockets
  • Quick changeover time for sockets and nozzle
  • Multiple form factor: WLCSP, MFF2, QFN, DFN, µSD...
Automated IC - SMD - eSIMs programming

Automated programming system with laser for IC, SMD and eSIMs

 

Advantages

  • Adapted to medium and large production runs
  • Automated pick & place of components for trays, up to 72 programming sockets
  • Pick and place of 8 components at once (more on demand)
  • Accepts various form factor: WLCSP, MFF2, µSD, BGA, QFN, DFN, SOIC, PLCC...
  • Quick changeover time for socket and nozzle

  

Options

  • Laser engraving (IR or UV)
  • OCR verification
  • AOI (automated Optical Inspection)
  • We can integrate YOUR programmers

 

Throughput examples (no laser, no OCR)

  • Functionality test: 3 200 uph with 8 sockets
  • 10s prog per SMD: 3 100 uph with 16 sockets
  • 30s prog per SMD: 2 200 uph with 24 sockets
  • 60s prog per SMD: 2 500 uph with 48 sockets
  • 2min prog per SMD: 1900 uph with 64 sockets

 

Throughput examples with laser and OCR

  • 10s prog per SMD: 2 000 uph with 16 sockets
  • 30s prog per SMD: 2 000 uph with 24 sockets
  • 60s prog per SMD: 2 000 uph with 48 sockets
  • 2min prog per SMD: 1700 uph with 64 sockets

  

Characteristics

  • Dimensions: 1800 x 1800 x 1920mm
  • Weight: 650 kg